Batch ALD

High-uniformity Batch ALD in a fully modular, volume-scalable architecture.

Chamber Volume 1 - 70L

Complex 3D Geometries

An ALD batch system engineered for R&D and small-scale production, designed to maintain exact conformality across variable 3D substrates.

Scalable Chamber Architecture

The chamber volume adjusts to accommodate specific 3D geometries. This architecture ensures strict coating homogeneity at optimized batch processing speeds.

Configurable Deposition Modes

The system accommodates both thermal and plasma-enhanced ALD (PE-ALD) configurations. This allows operators to utilize a broader range of precursor chemistries and tailor the thermal budget to specific substrate requirements.

Download SC Qube Spec Sheet

Technical Specifications.

Substrate Sizes

Single wafer 4 - 12"
Complex 3D substrates

Standard Materials

Al₂O₃, ZnO, SiO₂, TiO, Y₂O₃, ZrO₂, HfO₂, LiNbO₅, Nitrides, and others.

Precursors

Up to 16 gas sources with 10 individual inlets (Non-)heated precursor bubbler bottles
Ozone option
Novel bubbler delivery system optimised for low vapour pressure precursors

Temperature

Up to 400°C (higher on request)

Loading

Manual/automated front loading
Custom frame holders for 3D parts
Cleanroom and glovebox compatible.

Chamber Type

Thermal Chamber
FBR integration
MW PE-ALD

Chamber Dimensions

1 - 70
Multiple substrates or 3D objects of various shapes and sizes.
Dimensions of chamber and holder are optimally adapted to the parts and coating material.

Interfacing

Possible to interface with MES systems or other interfaces

Configure Your Architecture

Every system is tailored to specific deposition requirements. Contact our engineering team to review your process parameters and define the exact hardware configuration for your lab.

Discuss System Configuration